Highly versatile and multifunctional, the unit supports a large variety of COTS modules, including: Fully. Keying for Conduction Cooled VME64x: This standard is an extension of the VME64x Standard, ANSI/VITA 1. . 0 Serial: 2 RS-232/422/485 SATA: 6 eSATA. Switches, bridges and clock modules (PXIe), and even cooling are modular allowing for easy customization. 5-3- Two 4-lane PCIe fabric ports Power <15W Linux ® and WindRiver VxWorks BSPs Pin compatible with VPX3-131, VPX3-133 and VPX3-1257 Designed for harsh environment applications, both air-cooled and conduction-cooled Introduction Curtiss-Wright Defense Solutions' VPX3-This development chassis enables shortened design cycles for faster time to deployment. Just like the NI Ettus Research USRP E320, the VPX3-E320 features a flexible 2 x 2 MIMO RF Agile Transceiver with 12-bit ADC and DACs. Signal rate: 3. 9"L x 5. 1940000519-9001R 3U VPX Extender 3U for conduction cooled boards in conduction cooled chassis VITA 67. 11/SOSA-aligned and utilizes a Xilinx UltraScale+ ZU5EG MPSoC. Axis Tool Suite, Health Toolkit, Hardware. VX3060-S2 Rugged Air cooled variant is designed to meet VITA 47 class EAC6 V2 and can operate in extended temperature environ-ments up to of -40 °C/+70 °C. Study, diagrams and routing of the VPX and cPCI dual bus integrating high-speed links between. 2 Type 2, Secondary Side Retainer. The XPand1015 system is a low-cost development platform for conduction-cooled 6U VPX cards. The XPedite6101 provides a compact and cost-effective rugged computing solution with excellent processing performance-per-watt. The DK3 supports VPX development and integration activities for high speed C4ISR (Command, Control,. The XChange3031 is a conduction-cooled 3U VPX Ethernet switch module. It also supports IPv6 and a comprehensive set of IETF RFCs and IEEE protocols. Advanced airflow design distributes air across external fins in sidewalls. True 6-Channel design provides full OpenVPX. DECISIVE PERFORMANCE. This powerful 6 or 8-core processing module is dedicated to mil-aero edge-computing applications, where performance, efficiency and power management are required. 3 slots – ROHS and CE compliant articLe part. The WC31DH Chassis incorporates slots for up to eight conduction-cooled 3U VPX Payload Boards, two HD Switches, a Radial Clock, and two VITA 62 power supplies. EMG Lab at The Neuromuscular Diseases Unit (NDU) at VGH. With a Core 2 Duo processor at up to 2. The D575. StoreEngine is designed to work as a standalone single slot storage device with. VPX carrier cards provide a simple and cost-effective solution for interfacing mezzanine I/O modules to a VPX computer system. 10 RTM slots for accessing I/O from the corresponding 3U VPX modules installed in the XPand6200 Series. or 1. The XPand1202 provides a low-cost, flexible, VITA 67 development platform. pitch conduction-cooled VPX (VITA 48. Software. The XChange3012 supports an. 3U VPX boards, and utilizes RTMs to simplify I/O access and support rapid system prototyping. Small and extremely rugged, cold plate base coupled, conduction cooled enclosure measures 9″L x 6″W x 7. It provides an easy way to integrate switched mezzanine cards into modern VPX backplanes. LOWER RISK. 8 in. This platform supports up to eight 0. pitch with solder-side cover; Environmental Requirements. Quick. pitch;. True 6-Channel design provides full OpenVPX support. 2 applies to 3U and 6U VPX embedded computing modules, and defines the dimensions of plug-in units for conduction-cooled applications and connector-mounting details, as well as key sub. Learn more about this product below »Acromag’s XMC-7A200CC modules feature a high-performance user-configurable Xilinx® Artix®-7 FPGA enhanced with high-speed memory and a high-throughput serial bus interface. Development chassis and accessories for VPX and SOSA aligned module payloads to support every stage of product development. Depending on local conditions, packaging and freight charges might not be included. 8 in. The development kit includes the cables needed to connect the XPand6200. The XPand6904 supports the Intel® Atom™ E3800 family processor, which offers up to four cores at 1. These 3U VPX boards are delivered with full artifact packages to reduce the risk, cost, and development time required to reach certification. The versatile design allows multiple customizable configurations based on proven components and design techniques. The open frame concept offers enhanced flexibility, with fast conversion between air and conduction cooled module guides and fast backplane replacement for easy reconfiguration in support of. ANSI/VITA 0- 001[R 005] defines the rules for designing Our VPX backplanes are designed to allow any COTS or customer spec by providing a wide range of available VPX and OpenVPX profiles. Theconduction-cooled VPX load board helps confirm the chassis meets the VITA46/48/65 power specifications for VPX and aids in locating hot spots within theenclosure. Block Diagram. 125 Gb/sec. See specifications for target performance. Up to 32GB DDR4 ECC RAM. 88 in. 877-214-6267 salesacromag. 2, “Mechanical Specification for Microcomputers Using REDI Conduction Cooling Applied to VITA VPX”, developed by VITA, defines the mechanical requirements that are needed to ensure the mechanical interchangeability of air-cooled 3U and 6U plug-in units and define the features required to achieve two level maintenance compatibility. 2 conduction cooled modules and VITA 67. 2-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. 5th Generation Intel® Core™ i7 (Broadwell-H) Processor-Based Conduction- or Air-Cooled 3U VPX-REDI SBC with SecureCOTS™ The XPedite7572 single board computer is an optimal choice for computationally-heavy applications requiring maximum data and information protection. Controlled impedance rigid-flex-rigid design. Conduction-Cooled XMC with Dual 10 Gigabit Ethernet Interfaces and Rugged Optical Connector. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. Reviews aren't verified, but Google checks for and removes fake content when it's identified. Related products. Form Factor: Custom Chassis Type: Custom. The XPort3305 is a conduction-cooled dual 10 Gigabit Ethernet XMC with front and rear panel I/O support. Hartmann Electronic VPX Standard Chassis are designed to allow any COTS or customer spec configuration in either 3U or 6U form factor taking into account a wide range of. Integrated Conduction Cooled Assembly Designed for rugged conduction cooled assemblies (CCAs) in VPX systems, the High Thermal Integrated CCA design innovatively. The 12 slot power and ground backplane supports VITA 48. Single Slot 3U VPX Board Features • Largest available capacity in a single 3U VPX slot with dual SATA drives o Compliant with OpenVPXTM (VITA 65). 0 in. Learn more about this product below »XMC Module | Conduction- or Air-Cooled. 3U VPX, 6U VPX, and OpenVPX-based SBCs, I/O, storage, switches, rugged systems, and development platforms featuring Intel Core i7, Intel Xeon D, & Freescale QorIQ T-Series and P-Series processor technology. Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. XMC and AcroPack expansion slots add flexibility for on-board FPGA processing, I/O. 8 in. Go-No-Go indicators for 12V, 3. NXP (formerly Freescale) QorIQ P2020 Dual-Core Processor-Based Conduction- or Air-Cooled 3U VPX-REDI Single Board Computer. This platform supports up to eight 0. 0 Serial: 2 RS-232/422/485 SATA: 4. 0 and VITA 65 connector interoperability. 3U VPX boards, and utilizes RTMs to simplify I/O access and support rapid system prototyping. 11 12 V 3. Groove Width: 12. Available for use in either AC or DC systems, they are 6U high by 5HP (1-inch) wide modules with guide blocks, for use in VPX systems. pitch air-cooled VPX (VITA 48. AFT for VPX is supported with variations (“dot specifications”) through VITA 48. 3 to the P15 connector for interfacing with the host module. The AcroExpress® VPX6860 is a high performance 6U OpenVPX™ single board computer based on the 6th Generation Intel® Xeon® E processor (formerly Skylake) and PCH. It is designed for use in deployed industrial and military applications in harsh environments. Conduction Cooled Enclosure : Model CC E-3VX4 Another Performance Design from the Team at Dawn Conduction Cooled Enclosure. MIL-STD 461. RuSH controlled power and cooling supports high current demands and corresponding high cooling. 0 in. 3 slot apertures for a variety of RF and optical I/O connectors targeting a range of applications. Product Features. Form Factor: 6U VPX Chassis Type: Development Number of Slots: 2 Dimensions: 17. Author: Reggie. VTX989 is a five slot 3U VPX conduction cool chassis; Base plate cooling (cold wall is in the bottom of the chassis) Integrated Power Module within the Chassis; Support for VITA67. 3U OpenVPX™ form-factor (VITA65) Xilinx Kintex-7 325T/410Tuser-programmable FPGA. 8-2017, “Mechanical Standard for Electronic VPX Plug-in Modules Using Air Flow Through Cooling,” is a bit long-winded, but it’s essentially an air-cooled standard. Convection and Conduction cooled ATR (Air Transport Rack) enclosures offer a standardized, cost effective solution for PCI, VME, VME64x, VXS, cPCI and VPX based applications. Form Factor: 3U VPX. Documentation. Revolutionary design allows for up to 175. 0 in. A x8 PCI Express 2. While air and conduction cooling are often implemented to address cooling challenges, liquid cooling solutions can be effective for designs at the chassis, board, and chip levels. 85 and 1 in. 34. VPX/OpenVPX : Cooling: Liquid-Cooled : Depth: 12. VITA 62 3U 400W AC/DC VPX power supply; Universal AC Input: Single Phase, 85-264VAC, 47-400Hz;Air-cooled, conduction-cooled, REDI versions; 3U single PMC/XMC slot; PCIe x8 Gen 2 interface; These 3U mezzanine carrier cards provide a simple and cost-effective solution for interfacing a PMC or XMC module to a VPX computer system. This Standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two. Part of our line of conduction cooled enclosures with air assist, the AoC3U-1400 is designed to maintain safe operating temperatures for high slot. Backplanes are 100% configurable using Meritec cabling allowing. Chassis Cooling Forced Air Conduction Cooled Cold Plate Mounting, Convection Cooled (Fins Only), Liquid Cooled (Heat exchangers available by request)Load board for VPX systems, meets ANSI/VITA 46 mechani-cal and electrical connection standards Convection and conduction-cooled versions available Verifies chassis can meet power requirement and specifica-tions for VPX Assists in locating hot spots in the chassis Go/No-Go indicators for 12V, 3. 11(draft) System Management on VPX VITA 48. The top-loaded enclosure accepts 6U double-Eurocard-format conduction-cooled modules constructed to meet the IEEE1101. Keying for Conduction Cooled VME64x: This standard is an extension of the VME64x Standard, ANSI/VITA 1. 350 W VITA 62 PSU-Conduction Cooled. As system density has increased, the need for more aggressive and innovative thermal management techniques are needed. slots support conduction-cooled 3U VPX, 3U cPCI, or power supply modules. Creation of a specific board-cage to integrate conduction cooled VPX boards into a ventilated chassis. Mechanical: 3U VPX conduction cooled as per VITA 62, with wedge locks and extractor handles, 160 mm deep. 2 conduction cooled 6U VPX module with 1 inch pitch : • 6Ux160mm form factor as defined by IEEE 1101. 6U Conduction Cooled VPX Extender. XPand6902. 300-400 Watts Pluggable VPX PSU. Frame has injector/ejector latches for plug-in card. A brief low intensity electric current is applied to individual nerves, with recording. 14 Slot VPX Conduction-Cooled System with Air Assist. Up to 1080p30 or 1080i60. 8 in. Extremely robust, bullet proof design ♦ Fully integrated power supply, backplane, I/O in one box ♦ 4-Slots of 3u VPX on 1” pitch (OpenVPX Ready) ♦ Full environmental sealing per DO-160E ♦ Vita 48. conduction-cooled heatframes are mechanical assemblies which perfectly match the component topography & requirements of a pcb intended for an embedded computing. This efficient thermal design allows up to 60 W of. In some ways, AFT is a hybrid between air and conduction cooling, but with greater cooling capability. Air-cooled, conduction-cooled, REDI versions; 3U single PMC/XMC slot; PCIe x8 Gen 2 interface; These 3U mezzanine carrier cards provide a simple and cost-effective solution for interfacing a PMC or XMC module to a VPX computer system. Each DCM has 3Commercial Air-Cooled. 6U VPX Load Board Forced Air-Cooled Enclosure Two-Slot OpenVPX Development Platform IPv4/IPv6 Gigabit Ethernet Switch 4 0 On the Cover. With a total of six high-performance Gigabit Ethernet interfaces (2 routed, 4 switched), the 3U conduction-cooled (VITA 48. Request Information close. VENRAY, the Netherlands July 21st 2010 - VSN Systemen bv, a leading telecom hardware and software developer, launches OpenTSP NG technical building blocks,which are essential for the development of the newest multimedia applications. Failure to observe proper handling and installation procedures can6U, conduction-cooled VPX modules. This extensive line includes conduction cooled VPX, air cooled VPX, as well as VPX ATR configurations. or 1. (W) x 5. These rugged power supplies are available in 200W-1300W power configurations. Designed to meet the requirements of VITA 62 for use in harsh environments. 8 in. The logic-optimized FPGA is well-suited for a. Power and reset LEDs are provided for. 1x 100GBase-KR4, 1x 10/25GBase-KR. Desk-top chassis for 6U VPX cards (WxDxH: 350x435x593mm) For five front cards and RTMs with a card width of up to 1. 00" pitch. Mechanical frame supports 3U, 160mm plug-in card. 1 file(s) 861. 0 port is routed per VITA 42. Slots. 2 Type 2, Secondary Side Retainer. 52 in. Air-cooled models include an additional 10/100/1000Base-T port available on the front panel RJ45 connector. VPX MEDIA CONVERTER MODULE SUMMARY CF-020010-57X 57X Block Diagram VITA 48. OpenVPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments. Higher conduction means lower component temperatures . This allows for all the slots to be on the same non-blocking Ethernet switch instead of two switches chained. The up to 800 Watt power output true 6. 2 conduction cooled 6U VPX module with 1 inch pitch : • 6Ux160mm form factor as defined by IEEE 1101. XMC Adapter for 3U OpenVPX This electronics assembly can be damaged by ESD. Physical Characteristics. pitch conduction-cooled CompactPCI modules. 2 conduction cooled modules because of their established deployment track record. "With its optimized cooling path and quick turn customization of the. PCIe. 3 Up to 24x 10 GETH. 2. For use in DC systems, they are 3 U high by 5 HP (1-inch) wide modules with guide blocks, for use in conduction cooled VPX systems. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A Technology: VPXVPX336 / VPX340 are State-of-the-art, rugged VITA62 compliant 3U/0. Form Factor: 3U VPX Ethernet: 4 10/100/1000BASE-T USB: 2 USB 2. 3 Slot to 5 Slot each. 1 ATR platform with liquid cooled side walls, 6U conduction cooled boards, 1” pitch, per VITA 48. 0 standard by specifying additional mechanical details related to the frame construction of conduction-cooled modules. It supports up to two 0. 30 in. Conduction-Cooled. Conduction-cooled modules include an additional 10/100Base-TX port available on the rear VPX connector. Learn more about this product below » Acromag’s XMC-7A200CC modules feature a high-performance user-configurable Xilinx® Artix®-7 FPGA enhanced with high-speed memory and a high-throughput serial bus interface. conduction cooling. 950 inch Standard Conduction Cooled VITA Card in SOLIDWORKS. Combine various standard components to create a Wedge Lok that satisfies your requirements. Configure your PCB Wedge Lok. Max 10. or 1. 3U Air cooled models available in 1. 5, air flow-through, which has the advantage of being able to meter the air to specific cards. Load board for VPX systems, meets ANSI/VITA mechanical and electrical connection standards. Part of our AoC3u-600 Series of rugged packaging solutions, the AoC3U-610 is an ATR chassis designed to maintain safe operating temperatures for high power 3U VPX and SOSA aligned conduction cooled systems. 3U VPX carrier card. This emerging family of ATR chassis is designed to maintain safe operating temperatures for. The Atom™ E3800 processors provide excellent computational performance and I/O functionality for. View. Best Application: Where shock, vibration, and air contaminants are not an issue. Trident offers a wide range of ATR chassis that are convection, conduction cooled, forced air conduction cooled and liquid cooled. 1connectors not included 119EXT6024-06XXR 6U VPX Extender 6U - P0 utility, P1, P3 to P6 differential, P2 single ended 119EXT6024-05XXR 6U VPX Extender 6U - P0 utility, P1 to P6 differentialIt includes the complete connector complement under the standard thus enabling streamlined testing of target payloads. The carrier card routes power and bus signals to a plug-in mezzanine module through the VPX card slot connector. VITA 48. The XPedite7770 is a secure, high-performance single board computer based on the Intel® Xeon® D-1700 series (formerly Ice Lake-D) of processors, making it an optimal choice for computationally heavy applications requiring. 3"H. Level 5 Rugged Conduction Cooled. Compared to conventional wedgelocks, the ICE-Lok ® creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. It supports up to two 0. Eight 6U VITA 48. ½ ATR-compliant, natural convection-cooled or conduction-cooled chassis (reduced height and length) Dimensions: 10. VP32004 - LinkedHope Intelligent Technologies Co. 3 V. The AcroExpress ® VPX6600 is a high-performance 3U OpenVPX TM embedded single board computer based on the 6th Generation Skylake Intel ® Xeon ® E processor and PCH. It helps test a system's coolingcapabilities. Air-cooled, conduction-cooled and REDI versions; 3U Single XMC slot; PCIe x8 Gen 2 interface; The VPX4812A can be used as a VPX switch card allowing a host CPU to communicate with up to 3 downstream cards in addition to the XMC card. 8, air flow-through cooling without sealing for small form factor 3U and 6U VPX modules (ANSI ratified October 2017) The environment in which the boards will be. The XPand1007 can be configured as two I/O isolated slots, with all I/O from the payload passed to the RTM. The XPedite2570 is a high-performance, reconfigurable, conduction- or air-cooled, 3U VPX, FPGA processing module based on the Xilinx Kintex® UltraScale™ family of FPGAs. or 1. See full list on xes-inc. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. As module power continues to increase, however, VITA 48. Form Factor. See the Rugged section for more details. Built with aero-grade aluminum, the chassis are suitable for rugged onboard/mobile applications and can operate under extreme temperatures, dust and humidity. However, as module power continues to increase, VITA 48. The entire liquid conduction cooled chassis is built at our Longmont facility. View. manufactures a variety of COTS modular designed conduction cooled chassis for VPX, VME, CPCI and CPCIexpress applications,. 0 in. Created Date: 3/20/2017 10:06:58 AM. -40 - 85°C (Conduction Cooled) Capture only. Grabcad 3U Vita Card. Cooling: Conduction cooled. 6U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping. 2 / VPX conduction cooled thermal load board module. VPX is an ANSI standard that facilitates efficient upgrade to switched fabric technology for the sizeable existing base of VMEbus users, bringing them up to the task of supporting multiprocessing systems that demand the fastest possible communication capabilities. 2 * DDR4 banks (up to 4GB each) The IC-FEP-VPX3d is a 3U VPX FPGA processing board based on a Kintex® UltraScale™ FPGA (KU060, KU085 or KU115). A network-attached Flyable Data Loader (FDL). 00730 VITA 62 and MIL-STD compliant 3U DC-DC supply provides up to 360W output power while operating with highest efficiency. They are low-power system-on-chip (SoC. 3U Open VPX power supply Conduction cooled I 2 C IPMI 46. The IC-INT-VPX3e is a powerful OpenVPX 3U Single Board Computer (SBC) based on the Broadwell-DE processor – 14nm High Performance Chip of Intel’s Low Power Spectrum. Motorola – Single board chassis design with natural convection requirement. Boards are inserted in the back of the chassis in a vertical orientation. The SX-153 100/40. Of the two VPX mechanical form factors, 3U is very popular in certain applications, and 6U is sometimes necessary to build highly parallel systems with optimal computing density. In a VITA 48. 88 in. 2 mechanical format. I designed this 3U VPX 0. Our AoC chassis are designed for mission critical defense applications in the most extreme. LOWER RISK. 91 KB. 40GbE. It also supports dual Gigabit Ethernet, GPIO, I²C, XMC I/O, PMC I/O. Of the two VPX mechanical form factors, 3U is very popular in certain applications, and 6U is sometimes necessary to build highly parallel systems with optimal computing density. This platform supports up to eight 0. Our expertise also includes VITA 66,. A conduction-cooled option is available for more rugged operating environments. A momentary push button is provided for reset, and a switch is. Its short and efficient thermal conductivity path provides for robust cooling performance and maximum power dissipation. 3. 1-1997. (W) x 5. View product. It supports up to two 0. XIt1090 (90040065) - 3U VPX Rear Transition Module with 10 Gigabit Ethernet, eSATA, USB, Serial, and XIM Sites XPand1004 (90071810) - Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O XPand1203 (90072665) - 3U VPX Development Platform for Up to Eight Conduction-Cooled. Load sharing circuitry for up to 4 modules. This design and development were by MSS, including all the Windows-based software and qualification to full DO-160. 625 IN : Model Number:2. With dual PowerPC e600 cores running at up to 1. Load board for VPX systems, meets ANSI/VITA mechanical and electrical connection standards Convection and conduction-cooled versions available Verifies chassis can meet power requirement and specifica-tions for VPX Aids in locating hot spots in the chassis Go-No-Go indicators for 12V, 3. The XPedite7672 is an optimal choice for computationally heavy applications. 0 specification. 2 * DDR4 banks (up to 4GB each) The IC-FEP-VPX3d is a 3U VPX FPGA processing board based on a Kintex® UltraScale™ FPGA (KU060, KU085 or KU115). 2. pitch without solder-side cover (optional) 1. Accessories. close. 3U VPX Test Module performs a wide variety of functions and applications such as: Compliance testing of VITA Rules for OpenVPX conduction cooled systems; Design Validation of systems based on Power and Thermal simulation of deployed board set; Emulate system operating current profile based on multiple current image mapping of. OpenVPX now boasts several standards that provide various means of dissipating heat within a system. The 3U VPX form factor is compatible with several VITA standards including: VITA-46, VITA-48 and VITA-65. This system supports standard SBC and switch modules, as well as VITA 67 modules, making it the ideal platform for high-performance RF applications. 8 in. The XPand1007 system is a low-cost development platform for conduction-cooled 3U VPX cards. XPand1007. With multiple high-speed fabric interfaces, x8 PCI Express Gen3, 12 high-speed fiber-optic transceivers, and 8 GB of DDR4-2400 SDRAM in two channels, the. 2 Advanced Thermal Solutions High speed VPX systems demand advanced solutions to manage hot, power hungry board payloads. 3U VPX-REDI conduction-cooled form factor; Dimensions: 100 mm x 160 mm; 0. The XPand1007 can be configured as two I/O isolated slots, with all I/O from the payload passed to the RTM. This fully-defined, backplane-centric VPX module optionally supports either commercial GNSS receivers (i. We offer air & conduction cooled power supply units for wide range AC as well as DC input. Convection Cooled: SMA Jack (+3. 5, and Vulkan 1. 2775 Laurel Street Vancouver, BC V5Z 1M9. This standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two Level Maintenance compatibility. Part of our 1400 Series of conduction cooled enclosures with air assist, the 1440 is designed to maintain safe operating temperatures for high slot count 3U VPX systems and may be used as a deployment or development chassis. 3V, 5V, +12V_Aux, -12V_Aux & 3. 3 V. XChange3000. It defines a keying system that can be added to VME64x boards and backplanes in a conduction cooled environment (IEEE 1101. 87"W x 3. 35mm X 160mm] for circuit Boards & plug-in units with AIR or Conduction cool mechanism The base Mechanical specifications of PCB & Plug-In units are defined by VITA46 The Allowable Standoff Height for PMC/XMC is 10mm where 0. Part of our LoC3U-500 Series of liquid cooled enclosures, the LoC3U-510 is an ATR chassis designed to maintain safe operating temperatures for high power 3U VPX conduction cooled systems. Systems Integration Plus, Inc. Hartmann’s VPX Power Supplies are built for the most rugged applications with quality and reliability in mind. SX-153 Dual-Enclave 100/40 Gigabit Ethernet Switch. M4067 is a military grade 6U VPX, 115VAC 3 phase, AC-DC PSU card that provides six outputs per VITA 62 and is rated at 700W output power. The first100GbE 3U VPX SBC on the market aligned to SOSA 1; Up to 256 GB M. One Payload and remaining Peripheral Slots (with Switch slot option) High Speed fans with 1U Tray at the bottom. 2-2020: Mechanical Specification for Microcomputers Using REDI Conduction Cooling Applied to VPX; This Standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two. FPGA Family. 91 GHz. 2 Type 2, Secondary Side Retainer. Rugged, Conduction or Air cooled, 3U Dual Core 8640/41D PowerPC for VPX. VPX Backplane, 3 U, 5 Slots, Full-Mesh, Without RTM. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. 0 in. VPX-TF3090 3U VPX conduction cooled test frame with tBP-VPX3000. 0 in. Conduction-Cooled 3U VPX-REDI XMC Carrier Card. 10 Rear transition module on VPX VITA 46. Folder. XIt1097 (90074535) - 3U VPX Rear Transition Module with 40 Gigabit and 10 Gigabit Ethernet, USB, Serial, and XIM Site XPand1007 (90075300) - Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O XPand1203 (90072665) - 3U VPX Development Platform for Up to Eight Conduction-Cooled. Cisco ESR6300 with two routed, four switched Gigabit Ethernet interfaces. Two-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O. VITA 48. 2 -40°C to 85°C (Rugged Conduction Cooled)Dawn’s VPX Development System for 3U OpenVPX boards aligns well with the requirements specified within Draft 1. Air cooled: 3U VPX 0. (604) 875-4405. 4 PCI Express on VPX Fabric Connector VITA 46. 8 in. Table 1 below shows the significant increase in board power consumption over. Shock: 40G peak for conduction-cooled; Dimensions: 160mm x 100mm x 25. Supported ruggedization levels (see the X-ES. Innovative Integration recommends that all electronic assemblies and components circuits be handled with appropriate precautions. 3U VPX-REDI conduction- or air-cooled form factor; Dimensions: 100 mm x 160 mm; 0. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. The new cooling standard defines design requirements for platforms that need high performance processing, graphics. Features include OpenVPX. This. 8-inch and/or 1. 3V, 5V, +12V_Aux,ANSI/VITA 48. With Calmark Card Loks and Birtcher Wedge Loks. pitch conduction-cooled VPX (VITA 48. The chassis combines forced air with conduction cooling to dramatically increase thermal. Acromag’s XMC-7K modules feature a high-performance user-configurable Xilinx® Kintex®-7 FPGA enhanced with high-speed memory and a high-throughput serial bus interface. e. The high-density components that enable high-speed I/O also use more power, making advanced cooling methods essential for rugged VPX designs. These rugged power supplies are available in 200W-1300W power configurations. slots support conduction-cooled 3U VPX, 3U cPCI, or power supply modules. VPX systems are typically built with an air or conduction cooled chassis which holds the VPX backplane and provides the mechanical support for the VPX plug-in modules. 5"L x 5. The XChange3031 provides one backplane 40GBASE-KR4 Ethernet port, six backplane. Pixus also provides conduction-cooled and customized OpenVPX enclosure solutions. High bandwidth multiGig RT connector for VPX boards; Air- cooled and conduction-cooled versions; Overview. Our Card and Software Packages are Designed for Fast, Portable Integrations. OpenVPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments. 4mm; Weight: To be Announced;Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. The SBC627 rugged 6U VPX single board computer offers more processing power, more bandwidth, and more graphics capability – with no increase in the size, weight or power requirements of previous generations – enabling fewer system slots to be used. 4-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. XIt1085 (90040045) - 3U VPX Rear Transition Module with Gigabit Ethernet, SATA, USB, Serial, and DisplayPort XPand1004 (90071810) - Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O XPand1200 (90070530) - 3U VPX Development Platform for Up to Eight Conduction-Cooled. Compare. Mechanical frame supports 3U, 160mm plug-in card. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. The XPand1508 supports two standard VITA 46. Real-time video feedback for remote platforms ; Unmanned vehicles (UAV, ROV) Real-time IP video distribution. XIt1086. VITA 48. Conduction cooled at card edge (Air Flow Through or Air Flow Over available) Conformal coating on PWB; 3U VPX. Conforms to VITA 46 VPX specifications. Up to 20 CFM of airflow is provided per slot. Tested to MIL-STD-810, VITA 47. The Extreme Engineering Solutions XPand6200 Series Sub-1/2 ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules is a true Commercial-Off-The-Shelf (COTS) Rugged system, supporting many 3U VPX, XMC, and PMC modules without modifications to the chassis or backplane to. 2. REDI – FORM FACTORS REDI recommends two Board Sizes as 3U [100mm X 160mm] and 6U [233. 2) VPX router serves as an aggregation point for on-demand network connectivity in mobile or fixed deployments. It can. A common example of this is the conduction cooled chassis mounted onto a cold plate as shown in the below figure. The high-performance VX305C-40G is available in both air-cooled (for lab or other benign deployed environments) and conduction-cooled Plug-in units as per VITA 48. DescriptioN sa - staNDarD commerciaL vX3920 vX3920-sa-B1a00 3U VPX 10/40 GbE Switch, full managed L2, L3, QoS, Multicast, IPv6. or 1.